Liang Xin

Xin Liang is currently a full-professor at Colloege of Materials Science and Engineering at Beijing University of Chemical Technology (BUCT). He obtained his Bachelor's degree in materials physics from Univeristy of Science and Technology Beijing, Master's degree in materials engineering from McMaster Univerity (Advisors: Professor J. David Embury and Hatem S. Zurob), and then Master's degree and Ph.D. in Applied Physics from Harvard University (Advisor: Professor David R. Clarke). He then worked as a post-doc fellow at Harvard University and then Brown University. Prior to join BUCT, he was a full-professor at Changzhou University and University of Chinese Academy of Sciences. Professor Xin Liang's research group primarily focuses on  thermal and electrical transport properties and mechanical behavior of inorganic materials, covering ceramics, semiconductors, metals and alloys, composite materials, and amorphous materials. He has published 37 peer-reviewed journal papers including 9 papers in Acta Materialia and 7 papers in Applied Physics Letters. He wrote one chapter on thermal conductivity of ZnO based materials in Elsevier published scientific book. He has accomplished several research projects funded by governmental fundamental science funding like National Science Fundation of China (NSFC) and Chinese Academy of Sciences as well as by industry like CRRC. He was awarded the Jiangsu Province Distinguished Professor. He serves as a reviewer for more than 30 peer-reviewed scientific journals including Advanced Materials, Advanced Functional Materials, Materials Today, and Acta Materialia etc. 

Professor Xin Liang's research group currently works on the following fields:

(1) Thermal transport properties of ceramic/semiconductor/metallic materials, including bulk, thin films, and nanowires, etc;

(2) Developing applied materials for thermal engineering, such as thermal barrier coatings, thermal managemnet of semiconductor thin films and interfaces in microelectronics, ceramic substrate for heat sink in electronic packaging;

(3) Eletrical transport properties of Cu based composite materials;

(4) Micro/nano-scale physical property measurement with high spatial resolution.