IntroductionWang Yixuan, ph.D. is a lecturer at the College of Humanities and Law, Beijing University of Chemical Technology. Her research focuses on disaster and risk emergency management, as well as urban and rural resilient community development. EducationWork ExperienceSocial PositionSocial ActivitiesResearchDisaster and risk emergency management; Urban and rural resilient community TeachingPostgraduatesFundingHost：JSPS Integration of Society and Knowledge Innovative PhD Researcher Project 2021~2024 Host：Osaka University + Suita City Environmental Bureau PhD Innovation Project 2021~2022 Participant：JSPS Basic Research C Mixed Methods in Health Science 2021~2024 Vertical ProjectHorizontal ProjectPublications1. Wang, Yixuan. (2025) “Capabilities and Challenges of Chinese Women in Community-Based Disaster Management: Evidence from Urban, Rural and Minority Rural Communities”. Environmental hazards, pp.1–15. SSCI 2. Wang, Yixuan.& Otani, Junko. (2025).“The Differing Effectiveness of Social Capital in Building Disaster Resilience between China and Japan”. Osaka Human Sciences, Vol 11, pp. 99-129. 3. Wang, Yixuan. (2024). “Differences in the Effectiveness of Social Capital in Disaster-Affected Communities in China”. Mirai Kyoso:Journal of Collaborative Future Creation, Vol 10, pp. 25-56. 4. Wang, Yixuan.& Otani, Junko. (2024). “The Differing Effectiveness of Social Capital in Building Disaster Resilience between China and Japan”. Bulletin of Graduate School of Human Sciences Osaka University, Vol 50, pp. 15-33. 5. Wang, Yixuan. (2022). “The Reconstruction of The Intangible Cultural Properties of The Ethnic Minority-Form the Qiang Year in Mao County, Sichuan Province”. Disaster Recovery and Revitalization Review, Vol.10, No.2, pp. 35-43. 6.Wang,Yixuan. (2021) Intangible cultural properties of the Qiang after the 2008 Wenchuan Earthquake: Qiang Year in Mao County, (Chapter 5), In: Otani, Junko (eds.), Reconstructing Resilient Communities after the Wenchuan Earthquake: Disaster Recovery in China, Lexington Books: Rowman & Littlefield, pp. 185-214. AwardsPatentHonor RewardAdmissions Information |