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IntroductionXiao Ning, Senior Engineer and Master's Supervisor, works in College of Chemical Engineering. Academic Qualification: 2009-2014, Ph.D. in Chemical Engineering and Technology, Harbin Institute of Technology 2007-2009, Master's degree in Chemical Engineering and Technology, Harbin Institute of Technology 2003-2007, Bachelor's degree in Chemical Engineering and Technology, Harbin Institute of Technology(Weihai) EducationWork ExperienceSocial PositionSocial ActivitiesResearchResearch Interests My research focuses on the application of electrochemical technology and we try to solve the practical problems occurred in the production process by electrochemical technology. Specifically, my research focuses on: a) copper electroplating to fill the bilnd hole and through hole on the printed circuit board(PCB); b) water treatment process as well as non-standard equipment designing, such as circulating water,oily wastewater and wastewater containing heavy metal ions, etc. Teaching1.Basic Experiments for Chemical Engineering Total Class Hours: 32; 2. Professional Experiments for Chemical Engineering Total Class Hours: 32; 3. Scientific research: methodology and practice Total Class Hours: 48; PostgraduatesFundingNational Natural Science Foundation of China (No. 21902010) Vertical ProjectHorizontal ProjectPublications1. Chifei He, Haoran Li, Weixu Meng, Jing Li, Wenjuan Liu*, Ning Xiao*, Enhanced and Rapid Electro-oxidation Degradation for Highly Concentrated Tetracycline by Mn Nanoparticle-Doped NiAl-LDHs, ChemNanoMat, 2023, 1-9. 2. Huamei Xie, Biao Zhang, Chuangang Hu, Ning Xiao*, Dong Liu*, Boosting Li-CO2 battery performances by creating holey structure on CNT cathodes, Electrochimica Acta, 2022, 417: 140310. 3. Shenghao Zhao, Kaining Pang, Xiaojing Wang, Ning Xiao*, Function of Sulfhydryl (–HS) Group During Microvia Filling by Copper Plating, Journal of The Electrochemical Society, 2020, 167: 112502. 4. Shenghao Zhao, Kaining Pang, Yaning Huang, Ning Xiao*, Special electrochemical behaviour of sodium thiazolinyl-dithiopropane sulphonate during microvia filling, Transactions of The IMF, 2019, 97(4): 217-224. AwardsPatentHonor RewardAdmissions Information |